Equipment parameters | |
| Wafer size | Diameter: 6 inches, 8 inches |
| Wafer type | 150~725μm |
| Wafer material | Silicon, silicon carbide |
| Wafer type | Single flat, double flat, or V-shaped incision |
| Film type | Blue film or UV film |
Width: 230300mm, length: 100m; Thickness: 0.05-0.2mm | |
| frame type | 6-inch DISCO or K&S, 8-inch DISCO or K&S; Or specified by the customer |
| Mounting theory | Roller installation |
| Wafer placement to accuracy | X-Y:±0.1mm θ：±0.1° |
| input and output | Dual output chip box/single output frame box |
| Electrostatic Discharge control | Electrostatic roller/electrostatic discharge wafer chuck/electrostatic discharge blower |
| Wafer transfer | Horizontal multi-axis robot with vacuum or Bernoulli effector, intelligent mapping of wafer positioning and warping in the wafer box |
| wafer alignment | Fiber optic sensors for chip alignment |
| control unit | Standard Industrial PC, equipped with 17 inch display/touch screen |
| Power supplier | Individual communication 220V，25A |
| Air supplier | 5.0Kgf/cm2 CAD，150 l/min |
| Machinery manufacturing | All aluminum profile manufacturing |
| size | 1750mm（wide）X 1350mm（long）X 1800mm（tall） |
| net weight | 900 kg |
