Equipment parameters | |
Device Name | Fully automatic sorting machine |
Specifications and dimensions | Corresponding to 12 "to 8" wafers |
way | Fully automatic feeding and discharging |
Optional Scara arm (Tray discharge and transfer) | |
accuracy | ±50um |
speed | speed : 0.4 sec (machine cycle time) |
Production rate | High speed output (cycle time=0.45 seconds) |
Applied to general bare die and driver ICs | |
Continuous picking and continuous material state, process time varies with different materials | |
Equipment modification to meet the needs of third-generation semiconductors | |
Equipment parameters | |
way | semi-automatic |
size | Can correspond to 12-8 inch wafers and 2-4 inch tray or JEDEC tray |
Production rate | A highly elastic track placement system that can be quickly replaced with different types of tracks |
Chip Sorter | High speed retrieval and retrieval, UPH up to 12K |
accuracy | The accuracy of retrieval and placement is ± 50 μ Within m (paired with visual) |
Application of retrieval and placement module | Precision guide screw linear drive module |
Linear motor drive module | |
Linear motor drive module | |
Small size chip retrieval and placement (0.3mmx0.3mm) | |
Elastic design of vehicle platform | |
Application system for visual imaging, positioning, measurement, and inspection | |
Experience in High Cleanliness Class 100 Equipment | |
Independently developed PC Base electromechanical integrated automation system development | |
Suitable for various product variations and non-standard chip handling processes, such as optical glass, PCB, QFN, etc | |
