Vacuum sputtering double-sided copper plating equipment
Time:2023-05-13 15:53:11 Hits:122
Vacuum sputtering double-sided copper plating equipment


Equipment specifications and parameters

Magnetron sputtering cathode

1750*ID125*OD151 mm

Magnetically controlled cathode magnetic field

500~700G

POWER

Germany J.Schneider DC PULES  20KW

Gas material controller

Control range  0~1000Sccm

Control accuracy ± 2%



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